MULTICHIP SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device having a field programmable gate array which can reduce the number of outside connecting terminals. SOLUTION: A chip-on-chip semiconductor device is constituted by laying and joining a slave chip 2 upon and to the surface of a master chip 1. On the master chip 1, a field programmable gate array(FPGA) circuit 50 and a switching circuit 51 are formed. On the slave chip 2, a nonvolatile configuration memory circuit 60 is formed for storing the circuit setting information of the FPGA circuit 50. The FPGA circuit 50 or configuration memory circuit 60 is selectively connected to outside connecting pads 12 via the switching circuit 51. The memory circuit 60 can be programmed via the pads 12 and switching circuit 51. In addition, input and output can be made to and from the FPGA circuit 50 via the pads 12 and the switching circuit 51.