MANUFACTURE OF THREE-DIMENSIONAL CIRCUIT BOARD HAVING OPTICAL FUNCTION
PROBLEM TO BE SOLVED: To enable omitting the mounting process of a lens and a filter, simplifying the manufacturing process and realizing collectively forming an optical device and an electronic device in a unified body. SOLUTION: This method is a manufacturing method of a three-dimensional circuit...
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| creator | KAGAWA EIJI MUTO MASAHIDE |
| description | PROBLEM TO BE SOLVED: To enable omitting the mounting process of a lens and a filter, simplifying the manufacturing process and realizing collectively forming an optical device and an electronic device in a unified body. SOLUTION: This method is a manufacturing method of a three-dimensional circuit board 1 of a monolithic type where a lens function or an optical filter function or a high reflecting function or a complex function of them is installed as an optical function and built in the circuit board 1. In this case, resin is injection-molded, and a three-dimensional board 2 containing an optical configuration for optical function is formed. A plating base material conducting film 3 is formed by using thin film forming technique such as SVD and PVD. After that, patterning is performed by contour elimination of a circuit part 4 with laser work. An unnecessary film is eliminated by etching or the like after the thickening of the necessary circuit part 4 is performed by electroplating. |
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An unnecessary film is eliminated by etching or the like after the thickening of the necessary circuit part 4 is performed by electroplating.</description><edition>7</edition><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000908&DB=EPODOC&CC=JP&NR=2000244098A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000908&DB=EPODOC&CC=JP&NR=2000244098A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAGAWA EIJI</creatorcontrib><creatorcontrib>MUTO MASAHIDE</creatorcontrib><title>MANUFACTURE OF THREE-DIMENSIONAL CIRCUIT BOARD HAVING OPTICAL FUNCTION</title><description>PROBLEM TO BE SOLVED: To enable omitting the mounting process of a lens and a filter, simplifying the manufacturing process and realizing collectively forming an optical device and an electronic device in a unified body. 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An unnecessary film is eliminated by etching or the like after the thickening of the necessary circuit part 4 is performed by electroplating.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDzdfQLdXN0DgkNclXwd1MI8QhyddV18fR19Qv29Pdz9FFw9gxyDvUMUXDydwxyUfBwDPP0c1fwDwjxdAZKuoX6OYcA1fEwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDAwMjExMDSwtHY6IUAQAPAyzN</recordid><startdate>20000908</startdate><enddate>20000908</enddate><creator>KAGAWA EIJI</creator><creator>MUTO MASAHIDE</creator><scope>EVB</scope></search><sort><creationdate>20000908</creationdate><title>MANUFACTURE OF THREE-DIMENSIONAL CIRCUIT BOARD HAVING OPTICAL FUNCTION</title><author>KAGAWA EIJI ; MUTO MASAHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000244098A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>KAGAWA EIJI</creatorcontrib><creatorcontrib>MUTO MASAHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAGAWA EIJI</au><au>MUTO MASAHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF THREE-DIMENSIONAL CIRCUIT BOARD HAVING OPTICAL FUNCTION</title><date>2000-09-08</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To enable omitting the mounting process of a lens and a filter, simplifying the manufacturing process and realizing collectively forming an optical device and an electronic device in a unified body. SOLUTION: This method is a manufacturing method of a three-dimensional circuit board 1 of a monolithic type where a lens function or an optical filter function or a high reflecting function or a complex function of them is installed as an optical function and built in the circuit board 1. In this case, resin is injection-molded, and a three-dimensional board 2 containing an optical configuration for optical function is formed. A plating base material conducting film 3 is formed by using thin film forming technique such as SVD and PVD. After that, patterning is performed by contour elimination of a circuit part 4 with laser work. An unnecessary film is eliminated by etching or the like after the thickening of the necessary circuit part 4 is performed by electroplating.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | MANUFACTURE OF THREE-DIMENSIONAL CIRCUIT BOARD HAVING OPTICAL FUNCTION |
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