MANUFACTURE OF THREE-DIMENSIONAL CIRCUIT BOARD HAVING OPTICAL FUNCTION

PROBLEM TO BE SOLVED: To enable omitting the mounting process of a lens and a filter, simplifying the manufacturing process and realizing collectively forming an optical device and an electronic device in a unified body. SOLUTION: This method is a manufacturing method of a three-dimensional circuit...

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Bibliographische Detailangaben
Hauptverfasser:	KAGAWA EIJI, MUTO MASAHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable omitting the mounting process of a lens and a filter, simplifying the manufacturing process and realizing collectively forming an optical device and an electronic device in a unified body. SOLUTION: This method is a manufacturing method of a three-dimensional circuit board 1 of a monolithic type where a lens function or an optical filter function or a high reflecting function or a complex function of them is installed as an optical function and built in the circuit board 1. In this case, resin is injection-molded, and a three-dimensional board 2 containing an optical configuration for optical function is formed. A plating base material conducting film 3 is formed by using thin film forming technique such as SVD and PVD. After that, patterning is performed by contour elimination of a circuit part 4 with laser work. An unnecessary film is eliminated by etching or the like after the thickening of the necessary circuit part 4 is performed by electroplating.