SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a smaller miniaturized and thinner thin semiconductor device. SOLUTION: This semiconductor device has a semiconductor chip 1, provided with two kinds of electrodes 10 formed on the main surface on one side of its main surfaces and an electrode 13, which is formed by making a side surface part 132 extend from a bottom part 131 to come into contact with the opposite surface to the main surface on one side of the main surfaces of the chip 1 to the main surface on one side and consists of a conductive resin, and the two kinds of the electrodes 10 and the above conductive resin electrode are provided, in such a way that the directions in which the point parts of the electrodes 10 and the point part of the conductive resin electrode are extended are specified in the same direction.