ELECTRIC WIRE BUNDLE RETAINING STRUCTURE TO PLASTIC MOLDED PLATE SURFACE

PROBLEM TO BE SOLVED: To properly bundle a plurality of electric wires, to make freely attachably/detachably fixable them along one side of a plastic molded plate and to reduce the cost for fixing. SOLUTION: By forming a notch 2 on one side of a plastic molded plate 1, integrally extending a hook-sh...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KADOYA SHUHEI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To properly bundle a plurality of electric wires, to make freely attachably/detachably fixable them along one side of a plastic molded plate and to reduce the cost for fixing. SOLUTION: By forming a notch 2 on one side of a plastic molded plate 1, integrally extending a hook-shaped locking piece 3 covering the notch 2 by the depth part of this notch 2 and integrally and projectingly providing a bolster piece 4 on the plastic molded plate so as to be adjacent to the notch 2, inserting an electric wire bundle 5 into the locking piece 3 and supporting the electric wire bundle 5 on the bolster piece 4, the electric wire bundle 5 is formed into a gentle meandering shape and is retained onto the plastic molded plate 1.