CIRCUIT-FORMING METHOD AND BOARD FORMED USING THE SAME

PROBLEM TO BE SOLVED: To provide a circuit forming method which is capable of easily, and accurately and moreover inexpensively, forming a low-resistance circuit of conductive member on an insulating member and a board making advantage of the circuit forming method. SOLUTION: A mask pattern formatio...

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Bibliographische Detailangaben
1. Verfasser: SAKAMAKI KENJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a circuit forming method which is capable of easily, and accurately and moreover inexpensively, forming a low-resistance circuit of conductive member on an insulating member and a board making advantage of the circuit forming method. SOLUTION: A mask pattern formation step, where a film 2 is deposited on the surface of a base 1 and etched so as to leave a part which is used for the formation of a circuit pattern 3, and a mask pattern 8 where the circuit pattern 3 of the film 2 is formed, is formed on the base 1, an insulating member coating step where an insulating member 4 is formed on the one surface of the mask pattern 8 where the circuit pattern 3 of the film 2 is formed, a groove- forming step where a groove is cut in the insulating member 4 resting on the circuit pattern 3 of the film 2 by separating the cured insulating member 4 from the mask pattern 8, and a circuit formation step where grooves 6a cut in the insulating members 4 and 6 are filled with conductive member 7, to form a circuit formed of the conductive member 7 on the insulating member 6 are provided.