ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To suppress the diffusion in solid phase between an external electrode and a coated layer, by providing an electronic component with a coated layer consisting of solder on the external electrode made on the main body of the electronic component, and making the solder constituting the coated layer have tin for its main component, and besides, making the content of the same metal as the metal contained in the external electrode more than the eutectic concentration. SOLUTION: A stacked ceramic capacitor 11 is equipped with a chip-shaped capacity body 12 as the main body of an electronic part, and external electrodes 13 are made severally on the opposite end faces of the capacitor body 12. For example, the external electrode 13 is made of a film being made by giving paste containing metal such as, for example, copper, silver, or the like as conductive components and baking it. Though this electronic part is provided directly with a coated layer 15 on the external electrode 13, the coated layer 15 is constituted of the solder which has tin for its main component, and besides contains the same metal as the metal contained in the external electrode 13 more than the eutectic concentration. That is, the solder constituting the coated layer 15 contains the metal contained in the external electrode 13.