COOLING DEVICE AND COOLING DEVICE OF AIR-CONDITIONER

PROBLEM TO BE SOLVED: To reduce the influence of noise and at the same time promote radiation of heat from an electrical heating element such as a heat build-up element by thermally connecting the radiation part of the electrical heating element to the low-pressure part of a refrigeration cycle. SOL...

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1. Verfasser: KAWAKUBO MAMORU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To reduce the influence of noise and at the same time promote radiation of heat from an electrical heating element such as a heat build-up element by thermally connecting the radiation part of the electrical heating element to the low-pressure part of a refrigeration cycle. SOLUTION: A circuit substrate 2 where a semiconductor 1 for power is packaged is mounted and fixed to an electric panel box 3 with a mounting screw 5. The radiation part of the semiconductor 1 for power is thermally connected to one end of a heat pipe 7 via a mounting metal fitting 6a that is made of thermally conductive metal such as aluminum. Also, the heat pipe 7 is arranged through a through hole 4 being punched at the electric panel box 3, and the other end is thermally connected to refrigerant piping 8 at a refrigeration cycle low-pressure part via a mounting metal fitting 6b that is made of the thermally conductive metal such as aluminum. In this case, one end of the heat pipe 7 is connected to the refrigerant piping 8 via the mounting metal fitting 6b but may be connected to an accumulator.