LIQUID CRYSTAL DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a liquid crystal display device which is low in price and whose frame edge part is small and whose weight is light by miniaturizing package boards which are externally attached to an active matrix substrate in order to drive each TFT(thin film transistor) and making...

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Bibliographische Detailangaben
Hauptverfasser:	HIROBE TOSHIHIKO, HIBINO YOSHITAKA, KONDO NAOFUMI, TARUI TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a liquid crystal display device which is low in price and whose frame edge part is small and whose weight is light by miniaturizing package boards which are externally attached to an active matrix substrate in order to drive each TFT(thin film transistor) and making them light in weight when this device is provided with the active matrix substrate on which plural TFTs are provided in a matrix shape. SOLUTION: Plural TAB(tape automated bonding) substrates 2 on which driving ICs 7 are provided respectively are connected to an active matrix substrate 1 with an ACF(anisotropic conductive film) and moreover the driving IC 7... and source buss lines 6... are connected with the ACF. Furthermore, driving IC 7... adjacent each other are connected by common connection wirings 10 formed on the substrate 1.