CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To facilitate the manufacture and to excellently compensate various different thermal expansions. SOLUTION: The circuit device is equipped with a contact element which is electrically connected to a microstrip 7 of a microstrip line. The contact element has a conductive casing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WEIBLEN KURT, DIETERICH ACHIM, SEIZ JUERGEN, LUCAS BERNHARD, KUGLER ANDREAS
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To facilitate the manufacture and to excellently compensate various different thermal expansions. SOLUTION: The circuit device is equipped with a contact element which is electrically connected to a microstrip 7 of a microstrip line. The contact element has a conductive casing 3 and a ball 4 of conductive yarn or beltlike material in the casing 3. The casing 3 is electrically connected on the microstrip 7 and the clew body 4 presses a waveguide elastically.