MANUFACTURE OF HIGH FREQUENCY MODULE

PROBLEM TO BE SOLVED: To enable to easily manufacture a high frequency module which is small-sized and light in weight and has good handleability. SOLUTION: A method of manufacturing of a high frequency module, comprises a step of preparing a substrate 2 mounted with electronic components 3 and havi...

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Bibliographische Detailangaben
Hauptverfasser:	YASO TORU, NAKAYAMA NAOKI, HIROTA KOJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable to easily manufacture a high frequency module which is small-sized and light in weight and has good handleability. SOLUTION: A method of manufacturing of a high frequency module, comprises a step of preparing a substrate 2 mounted with electronic components 3 and having ground terminals 6a, 6b, 6c and 6d with predetermined heights, a step of covering the substrate 2 with a laminating sheet in which an insulating resin film 7 and a conductive film 8 having a shielding effect are laminated, a step of bringing the ground terminals 6a, 6b, 6c and 6d in continuity with the conductive film 8 by heating the substrate and softening the resin film 7.