SOLDERING APPARATUS

PROBLEM TO BE SOLVED: To suppress an oxidation of a solder of a solder tank and to improve a soldering speed by forming a chamber for a low oxygen atmosphere of an upper side cover and a lower side cover at an upper side of the tank, and providing an inert gas jetting part at the upper side of the c...

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Bibliographische Detailangaben
Hauptverfasser: OGURO KIYOUJI, HASEGAWA KIKETSU, MOTOMIYA IKUJIRO, TAN SUGURU
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To suppress an oxidation of a solder of a solder tank and to improve a soldering speed by forming a chamber for a low oxygen atmosphere of an upper side cover and a lower side cover at an upper side of the tank, and providing an inert gas jetting part at the upper side of the chamber, and a straightening plate having a plurality of pores at the lower side. SOLUTION: A chamber for a low oxygen atmosphere therein is formed of an upper side cover of an upper side of a work conveying means 4 and a lower side cover of a lower side at an upper side of a solder tank. A jetting part 42 for ejecting inert gas therein is arranged at an upper side in the chamber, and a straightening plate 43 having a plurality of pores 47 is provided between a conveying means and the jetting part 42 in the chamber to deal with a liquid surface area of the tank. Thus, inert gas injected from the injector 42 is held in a high concentration at an upper side of the chamber, slowly supplied to a lower part of the chamber through the pores 47 of the plate 43 to form a low oxygen atmosphere to conduct soldering. Accordingly, an oxidation of a solder is prevented, and soldering is effectively conducted.