SOLDERING APPARATUS

PROBLEM TO BE SOLVED: To prevent an oxidation of a solder and to exactly solder by holding an inert gas ejected from a jetting part in a high concentration at an upper side of a chamber and providing a straightening plate having an opening formed to supply the gas held in the high concentration at t...

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Bibliographische Detailangaben
Hauptverfasser:	MOTOMIYA IKUJIRO, TAN SUGURU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent an oxidation of a solder and to exactly solder by holding an inert gas ejected from a jetting part in a high concentration at an upper side of a chamber and providing a straightening plate having an opening formed to supply the gas held in the high concentration at the upper side of the chamber to a lower side of the chamber. SOLUTION: The soldering apparatus 1 comprises a solder tank 5 arranged at a lower side of a body frame 3, a sealed space constituted together with the tank 5 and a chamber 6 arranged and formed with a low oxygen atmosphere. A straightening plate 43 for straightening a flow of an inert gas ejected from a jetting part 42 is arranged at a upper side cover 26 side in the chamber 6. An oblique surface 45 is provided on the straightening plate 43, and the gas slowly flows toward the opening 47. A low oxygen atmosphere of the gas is formed in the chamber 6.