LOW RESILIENCY VIBRATION-ISOLATING PAD

PROBLEM TO BE SOLVED: To provide a vibration-isolating pad, which has a simple structure, in which low resiliency can be realized and which is manufactured easily. SOLUTION: The whole pad is molded of a soft rubber, columnar projections 5 and cylindrical projections 6 are zigzag formed approximately...

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Bibliographische Detailangaben
1. Verfasser: MURAKAMI KAZUYOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a vibration-isolating pad, which has a simple structure, in which low resiliency can be realized and which is manufactured easily. SOLUTION: The whole pad is molded of a soft rubber, columnar projections 5 and cylindrical projections 6 are zigzag formed approximately uniformly in a zigzag form on the upper surface and lower surface of the pad respectively, and the diameter S of the columnar projections 5 and the inside diameter T of the cylindrical projections 6 are equalized approximately. The centers of the columnar projections 5 formed to the upper surface and the centers of the cylindrical projections 6 formed to the lower surface coincide in the vertical direction.