WAFER-PROCESSING APPARATUS FOR MANUFACTURING SEMICONDUCTOR ELEMENT

WAFER-PROCESSING APPARATUS FOR MANUFACTURING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To provide a wafer-processing apparatus for manufacturing a semiconductor element, wherein uniformity in a process such as etching process or cleaning process is improved by minimizing changes in temperature of a wafer process solution supplied on a wafer attached stably to a s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KWACK GYU-HWAN, KO KEISEKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wafer-processing apparatus for manufacturing a semiconductor element, wherein uniformity in a process such as etching process or cleaning process is improved by minimizing changes in temperature of a wafer process solution supplied on a wafer attached stably to a spin chuck. SOLUTION: A spindle 2, a chuck 8 to which a wafer W supported by the spindle 2 is fixed, a solution nozzle 25 for supplying a wafer processing solution onto the wafer W, a gas supply path 4 for supplying gas to the rear surface of the wafer W, and a heater 30 for heating the gas supplied to the rear surface of the wafer W, are provided.