CONNECTING STRUCTURE AND CONNECTING METHOD OF ALUMINUM WIRING

PROBLEM TO BE SOLVED: To prevent corrosion and a disconnection of aluminum wiring in connecting the aluminum wiring and a bump of an IC chip with anisotropic conductive material. SOLUTION: Wiring of an electrode or the like in an envelop 3 is lead through on a surface of one end of a positive electrode substrate 4 extended to the outside of the envelop 3 of a fluorescent display tube 1, and an external terminal part 6 of an aluminum thin film is formed. A bump 11 of an IC chip 8 for driving the fluorescent display tube 1 is connected with connection end 6a of the external terminal part 6 by thermocompression bonding through anisotropic conductive material 10. The anisotropic conductive material 10 protrudes in an outer periphery of the IC chip 8 in thermocompression. The protruded anisotropic conductive material 10 is heated and is completely cured. Therefore, chlorine ion contained in the anisotropic conductive material 10 does not approach to the aluminum, and corrosion of the aluminum is prevented. A protective layer for covering a part not opposing to the bump is provided on the external terminal part 6. Therefore, the aluminum is not oxidized and a disconnection of the aluminum is prevented.