ELECTRICALLY CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive that has a sufficient adhesion strength and an electroconductivity with reduced fluctuation in its environmental properties by using a copper-including metal filler, an epoxy compound, a novolak type phenol resin, a low-molecular-weight p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEO ATSUSHI, MORI MARIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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