ELECTRICALLY CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive that has a sufficient adhesion strength and an electroconductivity with reduced fluctuation in its environmental properties by using a copper-including metal filler, an epoxy compound, a novolak type phenol resin, a low-molecular-weight p...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SEO ATSUSHI, MORI MARIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive that has a sufficient adhesion strength and an electroconductivity with reduced fluctuation in its environmental properties by using a copper-including metal filler, an epoxy compound, a novolak type phenol resin, a low-molecular-weight phenol and a curing agent. SOLUTION: The objective electroconductive adhesive is prepared by mixing 10-80 wt.% of an epoxy compound, for example, a bisphenol-A type epoxy resin, 2-40 wt.% of a novolak type phenol resin, 5-50 wt.% of a low-molecular- weight polyphenol, for example, hydroquinone, in addition, a curing agent, for example, a microcapsule type epoxy curing agent to prepare an organic binder, then admixing a metal filler containing 50-100% of copper to the resultant organic binder in an amount of 40-95 wt.%.