MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To provide a mounting structure for semiconductor element, which enables electrical connections to be maintained firmly and stably for a long period and the use reliability of a semiconductor element to be maintained at a significantly high level for a long period. SOLUTION: In...

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Bibliographische Detailangaben
Hauptverfasser:	AZUMA MASAHIKO, YONEKURA HIDETO, KOKUBU MASAYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting structure for semiconductor element, which enables electrical connections to be maintained firmly and stably for a long period and the use reliability of a semiconductor element to be maintained at a significantly high level for a long period. SOLUTION: In a mounting structure for semiconductor element, electrodes 6 formed on the lower surface 5 of a semiconductor element 1 are respectively connected to electrodes 8 formed on the upper surface 4 of a wiring board 2. The structure has such a feature, that a semiconductor element connecting surface 7 which protrudes with the same area as that of the lower surface 5 of the element or smaller is formed on the upper surface 4 of the board 2, and at the same time, a loading material 10 composed of a thermosetting resin containing a filler is interposed between the semiconductor element connecting surface 7 and the semiconductor element 1.