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PROBLEM TO BE SOLVED: To enhance suppression of a short-circuit caused by an operating error by connecting conductors at the same pitch on a predetermined part as a pitch of connecting pads, and providing dummy conductors having the same pitch as that of the predetermined part even on a larger part...

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Bibliographische Detailangaben
Hauptverfasser: ISO TOSHIAKI, MESAKI KUNIO, NAGASAWA TAKASHI, KOBAYASHI SHIGETAKA, OTSUKA OSAMU, OKI NORIO, TAKAMOTO MITSUO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enhance suppression of a short-circuit caused by an operating error by connecting conductors at the same pitch on a predetermined part as a pitch of connecting pads, and providing dummy conductors having the same pitch as that of the predetermined part even on a larger part than the connecting pitch. SOLUTION: A second board 21 has a part having a predetermined pitch of connecting pads and a part having larger pitch than that of the predetermined part. A width of a conductor 101 is preferably set to a width of 1/3 or less of a width of the connecting pad 201 of a second board 21, and 2/3 of the width of connecting pad 201 of the board 21. In the case of aligning for the connection, 2/3 of the width of the pad 201 of the board 21 can be prepared for the error. Further, a width of a conductor 101 of a surface not brought into contact with an insulating board 102 can be set to 1/3 or below of the width of the pad 201 of the board 21 by utilizing that a width of the conductor 101 of the surface not brought into contact with an insulating base material 102 becomes smaller than that of the conductor 101 of the surface brought into contact therewith. A pitch between the conductors is preferably in a range of 0.02 to 2 mm.