WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a wiring board with improved suppression of short- circuiting failures, and its manufacturing method. SOLUTION: A wiring board is provided with a plurality of conductors 6 for terminal which are in parallel at the end part of a substrate 1, and is also provided with...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUROKAWA HIROSHI, ISO TOSHIAKI, KOBAYASHI SHIGETAKA, OTSUKA OSAMU, OSAWA MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board with improved suppression of short- circuiting failures, and its manufacturing method. SOLUTION: A wiring board is provided with a plurality of conductors 6 for terminal which are in parallel at the end part of a substrate 1, and is also provided with a conductor 3 to a first terminal, that is formed over an outer shape line 2 of the end part before subjecting it to shape machining and a conductor 4 for a second terminal, that is formed only on the inside from the outer shape line 2 of the end part. The conductor 3 for the first terminal and the conductor 4 for the second terminal are formed alternately.