METHOD FOR DIVIDING SHEET-SHAPED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for dividing a sheet-shaped substrate for interposing a sheet-shaped substrate placed on the upper face of a first belt for division with a second belt for division for dividing the sheet-shaped substrate, and for accurately aligning the divided strip-shaped...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUJIMOTO KATSUYUKI, TANI SEIDO, KURODA YASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESISTORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for dividing a sheet-shaped substrate for interposing a sheet-shaped substrate placed on the upper face of a first belt for division with a second belt for division for dividing the sheet-shaped substrate, and for accurately aligning the divided strip-shaped substrates only on the upper face of the first belt for division. SOLUTION: This method for dividing a sheet-shaped substrate comprises a process for transferring a sheet-shaped substrate 13 placed on the upper face of a first belt 11 for carriage to the upper face of a first belt 17 for division, and for carrying this sheet-shaped substrate 13, and a process for interposing the sheet-shaped substrate 13 placed on the upper face of the first belt 17 for division through a films 26 for carriage with a second belt 22 for division, and for dividing the sheet-shaped substrate 13, and then for separating only the second belt 22 for division.