MAGNETO-OPTIC EFFECT ENHANCING ELEMENT AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To provide a magneto-optic effect enhancing element with an improved magneto-optic effect enhancing ratio by preparing a ferritic film with a ferritic plating method without high temperature-heating. SOLUTION: A magneto-optic effect enhancing element having a sandwiched structu...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ABE MASANORI, KITAMOTO JINKO, INOUE MITSUTERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRICITY FREQUENCY-CHANGING INDUCTANCES INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MAGNETS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TESTING TRANSFORMERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a magneto-optic effect enhancing element with an improved magneto-optic effect enhancing ratio by preparing a ferritic film with a ferritic plating method without high temperature-heating. SOLUTION: A magneto-optic effect enhancing element having a sandwiched structure to satisfy the Fabry-Perot resonance condition is manufactured by forming a first dielectric multilayer reflection film 1, with two kinds of dielectric films 4, 5, 6, 10, 11, 12 stacking alternately by vacuum depositing or sputtering on a substrate, by forming a ferritic film 3 by a ferritic plating method at >=20 deg.C and