ELECTROLESS SILVER PLATING SOLUTION FOR ELECTRONIC PARTS

PROBLEM TO BE SOLVED: To obtain an electroless silver plating soln. for electronic parts having a migration preventive effect and by which the service life of a plating bath is prolonged. SOLUTION: This soln. consists of silver nitrate, a silver complexing agent consisting of a hydantoin compd., a f...

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Hauptverfasser:	TAKASAKI TAKAHARU, SERIZAWA SEIICHI, IGAWA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an electroless silver plating soln. for electronic parts having a migration preventive effect and by which the service life of a plating bath is prolonged. SOLUTION: This soln. consists of silver nitrate, a silver complexing agent consisting of a hydantoin compd., a fluoric surfactant and a pH buffer salt. The soln. contains 0.05-30 g/l silver ion, 0.1-200 g/l hydantoin compd. and 0.01-10 g/l fluoric surfactant and further contains an inorg. acid, an org. acid or both as the pH buffer salt. At least one kind among hydantoin, 5,5-dimethylhydantoin, 1,3-dimethylhydantoin and 1-methylhydantoin is used as the hydantoin compd.