SIZING LAP DEVICE

PROBLEM TO BE SOLVED: To lap precisely by regulating the polishing amount of a workpiece partially, in response to the polishing state of the workpiece in a lapping. SOLUTION: This device is provided with a disc shape lap surface plate 10 to which a polishing liquid is supplied and provided turnably...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKABAYASHI ISAO, MIYAZAKI MASAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To lap precisely by regulating the polishing amount of a workpiece partially, in response to the polishing state of the workpiece in a lapping. SOLUTION: This device is provided with a disc shape lap surface plate 10 to which a polishing liquid is supplied and provided turnably, one or more holders 15 for holding a workpiece and pressing the workpiece for the lap surface plate 10, a support shaft 13 provided in an erection state for the lap surface plate 10 and supporting the holder 15, an oscillation mechanism F oscillating and turning the support shaft 13 around its axis, a base board 11 supported turnably the support shaft 13 around its axis, and a base board swing mechanism for reciprocating this base board 11 in the diameter direction of the lap surface plate 10 or in the nearly parallel direction with the diameter direction.