ELECTRONIC COMPONENT MOUNTING STRUCTURE, MANUFACTURE THEREOF, WIRELESS IC CARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To realize in a simple process connection and mounting between electronic components of semiconductor elements, module boards, indication elements, etc., and a wiring conductor patterned on a sheet with a raised connection reliability to manufacture with a high yield a low cost...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUMOTO KUNIO, WAI SHINICHI, HASHIMOTO YUTAKA, OZEKI YOSHIO, TAKAOKA ISAMU, SAKAGUCHI MASARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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