ELECTRONIC COMPONENT MOUNTING STRUCTURE, MANUFACTURE THEREOF, WIRELESS IC CARD AND MANUFACTURE THEREOF

ELECTRONIC COMPONENT MOUNTING STRUCTURE, MANUFACTURE THEREOF, WIRELESS IC CARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To realize in a simple process connection and mounting between electronic components of semiconductor elements, module boards, indication elements, etc., and a wiring conductor patterned on a sheet with a raised connection reliability to manufacture with a high yield a low cost...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATSUMOTO KUNIO, WAI SHINICHI, HASHIMOTO YUTAKA, OZEKI YOSHIO, TAKAOKA ISAMU, SAKAGUCHI MASARU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To realize in a simple process connection and mounting between electronic components of semiconductor elements, module boards, indication elements, etc., and a wiring conductor patterned on a sheet with a raised connection reliability to manufacture with a high yield a low cost. SOLUTION: A wiring conductor 22 is patterned on a wiring sheet base 21 with sharply tipped bumps formed on electrode pads of an electronic component 10, thereby forming a wiring sheet 20 on which connection parts of the wiring conductor are broken through to mutually diffuse the connection parts of the bumps and the wiring conductor to bond and connect them, and the gap between the electronic component 10 and the wiring sheet 20 is filled with a seal resin.