ELECTRONIC COMPONENT MOUNTING STRUCTURE, MANUFACTURE THEREOF, WIRELESS IC CARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To realize in a simple process connection and mounting between electronic components of semiconductor elements, module boards, indication elements, etc., and a wiring conductor patterned on a sheet with a raised connection reliability to manufacture with a high yield a low cost...

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Hauptverfasser:	MATSUMOTO KUNIO, WAI SHINICHI, HASHIMOTO YUTAKA, OZEKI YOSHIO, TAKAOKA ISAMU, SAKAGUCHI MASARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	MATSUMOTO KUNIO WAI SHINICHI HASHIMOTO YUTAKA OZEKI YOSHIO TAKAOKA ISAMU SAKAGUCHI MASARU
description	PROBLEM TO BE SOLVED: To realize in a simple process connection and mounting between electronic components of semiconductor elements, module boards, indication elements, etc., and a wiring conductor patterned on a sheet with a raised connection reliability to manufacture with a high yield a low cost. SOLUTION: A wiring conductor 22 is patterned on a wiring sheet base 21 with sharply tipped bumps formed on electrode pads of an electronic component 10, thereby forming a wiring sheet 20 on which connection parts of the wiring conductor are broken through to mutually diffuse the connection parts of the bumps and the wiring conductor to bond and connect them, and the gap between the electronic component 10 and the wiring sheet 20 is filled with a seal resin.
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	ELECTRONIC COMPONENT MOUNTING STRUCTURE, MANUFACTURE THEREOF, WIRELESS IC CARD AND MANUFACTURE THEREOF
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