SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING INTEGRATED CIRCUIT CHIP TO ORGANIC SUBSTRATE

PROBLEM TO BE SOLVED: To obtain a method for directly mounting a semiconductor chip to an organic substrate. SOLUTION: This integrated circuit chip 10 mounting method for an organic substrate 11 is composed of a step wherein an integrated circuit chip 10 having an active surface 102, containing a pr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YEW CHEE KIANG, AMAMI MASAZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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