SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING INTEGRATED CIRCUIT CHIP TO ORGANIC SUBSTRATE

PROBLEM TO BE SOLVED: To obtain a method for directly mounting a semiconductor chip to an organic substrate. SOLUTION: This integrated circuit chip 10 mounting method for an organic substrate 11 is composed of a step wherein an integrated circuit chip 10 having an active surface 102, containing a protective polymer layer 12, and a passive surface 10b, is provided, a step wherein the polymer layer 12 is activated by increasing its surface roughness by performing a reactive ion etching plasma exposing operation, a step wherein an electrically insulated substrate 11 having the first and the second surfaces 11a and 11b, is provided, and a step wherein the substrate 11 is directly activated to the chip 10 by having the second surface 11b of the substrate 11 brought into contact with the activated polymer 12 and by adding strong adhesion to the interface between the layer 12 and the substrate 11.