TIN-CONTAINING COPPER ALLOY MATERIAL EXCELLENT IN SOLDERABILITY

PROBLEM TO BE SOLVED: To produce an Sn-contg. copper alloy material excellent in solderability and to provide a method for confirming the quality thereof. SOLUTION: In this Sn-contg. copper alloy material, the Sn3d/Cu2p ratio in the peak area ratio of the quantitative analysis in the case the surfac...

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Hauptverfasser:	MASAGO YASUSHI, TSUNO RIICHI, MATSUI TAKASHI, KANAO KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS TESTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To produce an Sn-contg. copper alloy material excellent in solderability and to provide a method for confirming the quality thereof. SOLUTION: In this Sn-contg. copper alloy material, the Sn3d/Cu2p ratio in the peak area ratio of the quantitative analysis in the case the surface is measured by X-ray photoelectron spectroscopy is controlled to