MANUFACTURE OF NONCONTACT TYPE IC CARD AND NONCONTACT TYPE IC CARD

PROBLEM TO BE SOLVED: To eliminates the need for many processes and facilities by making a high-reliability connection by using a low-temperature joining process and reducing the thickness when an IC chip is mounted on an antenna substrate. SOLUTION: This method has a process for forming an antenna pattern and a connection terminal part 5 on a base material 2 by using 1st conductive resin 4, a process for forming a through hole 6 in the connection terminal part 5, an antenna substrate forming process having a process for charging 2nd conductive resin 7 in the hole part of the through hole 6, and a process for mounting the IC chip 10 on the antenna substrate 8 by joining the part except a bump 9 on the bump formation surface of the IC chip 10 to the base material 2 by applying an insulating high-polymer adhesive 11 to the part and joining the bump 9 to the connection terminal part 5 while inserting and joining the bump 9 to 2nd conductive resin 7. Here, the 1st conductive resin 4, 2nd conductive resin 7, and high polymer adhesive 11 are heated and hardened at the same time.