LAMINATED CERAMIC CHIP COMPONENT AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To mount electronic components in high density and form external electrodes with extreme accuracy and with case, at low cost. SOLUTION: External electrodes 3, 4 comprise electrode parts 3a, 3b for soldering by a printed film, made of conductive paste provided closer to both end...

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Bibliographische Detailangaben
1. Verfasser: ABIKO TAISUKE
Format: Patent
Sprache:eng
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