LAMINATED CERAMIC CHIP COMPONENT AND MANUFACTURE THEREOF

LAMINATED CERAMIC CHIP COMPONENT AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To mount electronic components in high density and form external electrodes with extreme accuracy and with case, at low cost. SOLUTION: External electrodes 3, 4 comprise electrode parts 3a, 3b for soldering by a printed film, made of conductive paste provided closer to both end...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ABIKO TAISUKE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To mount electronic components in high density and form external electrodes with extreme accuracy and with case, at low cost. SOLUTION: External electrodes 3, 4 comprise electrode parts 3a, 3b for soldering by a printed film, made of conductive paste provided closer to both ends on the surface of a ceramic element body C facing opposite the surface of a circuit board P and electrode parts 4a, 4b for connecting internal electrodes with a transfer film made of conductive paste provided on the end portion surface of the ceramic element body C, by electrically connecting with lead ends internal electrodes 1a to 1h and the electrodes 3a, 3b for soldering.