HEAT- OR ULTRAVIOLET-INITIATING LATENT CURING AGENT FOR EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING SAME, AND CURED EPOXY PRODUCT

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can cure at a relatively low temperature within a short time and has a storage life of several months or longer by using N-benzylpyrazinium hexafluoroantimonate as an epoxy latent curing agent which latently cures an epoxy resin under...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BOKU SHUSHIN, RI SAIRAKU, KAKU KONKO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can cure at a relatively low temperature within a short time and has a storage life of several months or longer by using N-benzylpyrazinium hexafluoroantimonate as an epoxy latent curing agent which latently cures an epoxy resin under the influence of heat and/or ultraviolet light. SOLUTION: It is desirable that the epoxy resin comprises an alicyclic epoxy resin, a difunctional bisphenol A epoxy resin or a mixture thereof in a mixing ratio of 60 mol%: 40 mol% to 20 mol%: 80 mol%. The heat curing temperature is 70-200 deg.C, desirably, 170-200 deg.C. It is desirable that the surroundings around the curing system in ultraviolet curing is made of a transparent material to permit ultraviolet transmission therethrough, the distance between the ultraviolet source and the curing system is kept at 10-20 cm, and the curing system is photocured under conditions in which the surroundings around the curing system is inclined at moat 7 deg. with respect to the horizontal plane.