VACUUM FILM FORMING DEVICE
PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming va...
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| creator | SHIMAZAKI KATSUSUKE ISHIBASHI YOSHIYA HAYASHIDA HIDEKI MAJIMA KAZUYUKI |
| description | PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming various thin films on plural substrates. SOLUTION: A substrate carrier 17 mounted with plural substrates 21 is carried in through a load lock chamber 12 and is moved to a sputtering chamber, where a substrate shutter attaching/detaching mechanism is provided on a sputtering device. The substrate carrier is provided with a substrate holder 18, and the substrate holder is freely rotatable. Each plural substrate holding part 20 in the substrate holder is provided with a shutter attaching column 23. A freely attachable and detachable sticking preventing shutter 22 for preventing the formation of a thin film on the substrate mounted on the substrate holding part and a sticking preventing shutter attaching/detaching mechanism 30 executing the attaching and detaching of the sticking preventing shutter are provided for the device. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2000119852A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2000119852A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2000119852A3</originalsourceid><addsrcrecordid>eNrjZJAKc3QODfVVcPP0ARL-Qb6efu4KLq5hns6uPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDAwNDQ0sLUyNGYKEUAZBsgiA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VACUUM FILM FORMING DEVICE</title><source>esp@cenet</source><creator>SHIMAZAKI KATSUSUKE ; ISHIBASHI YOSHIYA ; HAYASHIDA HIDEKI ; MAJIMA KAZUYUKI</creator><creatorcontrib>SHIMAZAKI KATSUSUKE ; ISHIBASHI YOSHIYA ; HAYASHIDA HIDEKI ; MAJIMA KAZUYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming various thin films on plural substrates. SOLUTION: A substrate carrier 17 mounted with plural substrates 21 is carried in through a load lock chamber 12 and is moved to a sputtering chamber, where a substrate shutter attaching/detaching mechanism is provided on a sputtering device. The substrate carrier is provided with a substrate holder 18, and the substrate holder is freely rotatable. Each plural substrate holding part 20 in the substrate holder is provided with a shutter attaching column 23. A freely attachable and detachable sticking preventing shutter 22 for preventing the formation of a thin film on the substrate mounted on the substrate holding part and a sticking preventing shutter attaching/detaching mechanism 30 executing the attaching and detaching of the sticking preventing shutter are provided for the device.</description><edition>7</edition><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INFORMATION STORAGE ; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PHYSICS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000425&DB=EPODOC&CC=JP&NR=2000119852A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000425&DB=EPODOC&CC=JP&NR=2000119852A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMAZAKI KATSUSUKE</creatorcontrib><creatorcontrib>ISHIBASHI YOSHIYA</creatorcontrib><creatorcontrib>HAYASHIDA HIDEKI</creatorcontrib><creatorcontrib>MAJIMA KAZUYUKI</creatorcontrib><title>VACUUM FILM FORMING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming various thin films on plural substrates. SOLUTION: A substrate carrier 17 mounted with plural substrates 21 is carried in through a load lock chamber 12 and is moved to a sputtering chamber, where a substrate shutter attaching/detaching mechanism is provided on a sputtering device. The substrate carrier is provided with a substrate holder 18, and the substrate holder is freely rotatable. Each plural substrate holding part 20 in the substrate holder is provided with a shutter attaching column 23. A freely attachable and detachable sticking preventing shutter 22 for preventing the formation of a thin film on the substrate mounted on the substrate holding part and a sticking preventing shutter attaching/detaching mechanism 30 executing the attaching and detaching of the sticking preventing shutter are provided for the device.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INFORMATION STORAGE</subject><subject>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PHYSICS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKc3QODfVVcPP0ARL-Qb6efu4KLq5hns6uPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDAwNDQ0sLUyNGYKEUAZBsgiA</recordid><startdate>20000425</startdate><enddate>20000425</enddate><creator>SHIMAZAKI KATSUSUKE</creator><creator>ISHIBASHI YOSHIYA</creator><creator>HAYASHIDA HIDEKI</creator><creator>MAJIMA KAZUYUKI</creator><scope>EVB</scope></search><sort><creationdate>20000425</creationdate><title>VACUUM FILM FORMING DEVICE</title><author>SHIMAZAKI KATSUSUKE ; ISHIBASHI YOSHIYA ; HAYASHIDA HIDEKI ; MAJIMA KAZUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000119852A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INFORMATION STORAGE</topic><topic>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PHYSICS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMAZAKI KATSUSUKE</creatorcontrib><creatorcontrib>ISHIBASHI YOSHIYA</creatorcontrib><creatorcontrib>HAYASHIDA HIDEKI</creatorcontrib><creatorcontrib>MAJIMA KAZUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMAZAKI KATSUSUKE</au><au>ISHIBASHI YOSHIYA</au><au>HAYASHIDA HIDEKI</au><au>MAJIMA KAZUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VACUUM FILM FORMING DEVICE</title><date>2000-04-25</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming various thin films on plural substrates. SOLUTION: A substrate carrier 17 mounted with plural substrates 21 is carried in through a load lock chamber 12 and is moved to a sputtering chamber, where a substrate shutter attaching/detaching mechanism is provided on a sputtering device. The substrate carrier is provided with a substrate holder 18, and the substrate holder is freely rotatable. Each plural substrate holding part 20 in the substrate holder is provided with a shutter attaching column 23. A freely attachable and detachable sticking preventing shutter 22 for preventing the formation of a thin film on the substrate mounted on the substrate holding part and a sticking preventing shutter attaching/detaching mechanism 30 executing the attaching and detaching of the sticking preventing shutter are provided for the device.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VACUUM FILM FORMING DEVICE |
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