VACUUM FILM FORMING DEVICE

PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming va...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIMAZAKI KATSUSUKE, ISHIBASHI YOSHIYA, HAYASHIDA HIDEKI, MAJIMA KAZUYUKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a vacuum film forming device provided with a substrate shutter attaching/detaching mechanism applying different film forming conditions under the same environment to plural substrates arranged on a substrate carrier in a film forming chamber and capable of forming various thin films on plural substrates. SOLUTION: A substrate carrier 17 mounted with plural substrates 21 is carried in through a load lock chamber 12 and is moved to a sputtering chamber, where a substrate shutter attaching/detaching mechanism is provided on a sputtering device. The substrate carrier is provided with a substrate holder 18, and the substrate holder is freely rotatable. Each plural substrate holding part 20 in the substrate holder is provided with a shutter attaching column 23. A freely attachable and detachable sticking preventing shutter 22 for preventing the formation of a thin film on the substrate mounted on the substrate holding part and a sticking preventing shutter attaching/detaching mechanism 30 executing the attaching and detaching of the sticking preventing shutter are provided for the device.