MEASUREMENT MOUNTING DEVICE AND SOLDERING DEVICE

PROBLEM TO BE SOLVED: To provide a measurement mounting device which improves a productivity of mounting electronic parts for circuit test and for adjustment. SOLUTION: The measurement mounting device includes dip switch change- over parts 3-1 and 3-2 for checking change-over and end of the switchin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OTANI MOTOMU, IKEGAME ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a measurement mounting device which improves a productivity of mounting electronic parts for circuit test and for adjustment. SOLUTION: The measurement mounting device includes dip switch change- over parts 3-1 and 3-2 for checking change-over and end of the switching on a mounting substrate 9, adjustment resistance measuring parts 5-1 and 5-2 for measuring electrical characteristics of the substrate 9, an adjustment resistance measuring unit 4 for selecting the electronic parts to adjust the electrical characteristics of the substrate, an adjustment resistance mounting part 7 for arranging the selected electronic part on the substrate, and a soldering part 8 for fixing the arranged electronic part to the substrate.