MANUFACTURE OF ELECTRONIC COMPONENT EMBEDDED LAMINATE

MANUFACTURE OF ELECTRONIC COMPONENT EMBEDDED LAMINATE

PROBLEM TO BE SOLVED: To manufacture an electronic component embedded laminate wherein not curling occurs with constant thickness, without damage to an electronic component nor surface. SOLUTION: Related to a method for manufacturing an electronic component embedded laminate 23, a step where an elec...

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Bibliographische Detailangaben
Hauptverfasser: SASAKI AKIRA, FUKANO KATSUNORI, ENDO YASUSHI, KANEOKA TSUGIO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To manufacture an electronic component embedded laminate wherein not curling occurs with constant thickness, without damage to an electronic component nor surface. SOLUTION: Related to a method for manufacturing an electronic component embedded laminate 23, a step where an electronic part 6 is installed on a hot- melt resin 3a laminated on a first sheet 2, step where a second sheet 9 where a hot-melt resin 3b is laminated is laminated on the electronic component 6 installed on the first sheet 2 starting with the laminating side of the hot-melt resin 3b, and a step where the laminated first and second sheets 2 and 9 are sandwiched between a pair of, upper and lower, belts 14 and 15 pressurized by a fluid and pressurized from above and below while transported along the moving direction of the belts 14 and 15, are provided.