SEMICONDUCTOR WET-ETCHING APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor wet etching device capable of manufacturing a fine quality wafer by removing the by-products of the wafer. SOLUTION: This apparatus comprises a bath 10 for accommodating chemicals 3, a chemicals supply part for supplying the chemicals 3 to the bath 10, a chemicals discharge port 10a for externally discharging the chemicals 3 accommodated in the bath 10, a wafer guide 30 for grasping a wafer 1 so that a face for use of the wafer 1 is directed downward and for orienting the wafer 1 in a chemicals liquid, a robot for loading and unloading the wafer 1, and a chemicals jet part 20 for jetting the chemicals 3 on the wafer 1 under high pressure. Thus, since the face for use of the wafer 1 is directed downward, foreign substances of the wafer 1 which is etched by the chemicals is completely broken away from the wafer 1 by gravity.