MULTICHIP MODULE AND TEST METHOD THEREFOR

MULTICHIP MODULE AND TEST METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide an MCM having a structure capable of reliably specifying a failure chip in a multichip module(MCM) and specifying a position of a failure place, and a test method therefor. SOLUTION: In an MCM M1 by highly densely mounting plural bare chips on a multichip board havin...

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Bibliographische Detailangaben
1. Verfasser: ASADA YASUNORI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an MCM having a structure capable of reliably specifying a failure chip in a multichip module(MCM) and specifying a position of a failure place, and a test method therefor. SOLUTION: In an MCM M1 by highly densely mounting plural bare chips on a multichip board having a thin film wiring layer, supply means P1 to P4 are arranged to individually supply a power source to the whole bare chips on the multichip board. In this MCM M1, a test is performed by successively repeating a procedure of supplying the power source to only a testing object bare chip among plural bare chips and of not supplying the power source to the other bare chips by changing the testing object bare chip.