THERMOSETTING POWDER COATING MATERIAL COMPOSITION EXCELLENT IN CUTTING WORKABILITY AND FORMATION OF COATING FILM USING THE SAME

PROBLEM TO BE SOLVED: To obtain a thermosetting powder coating material composition excellent in storage stability and solid-phase reaction resistance and further excellent in cutting workability and impact resistance of a coating film after coating and to provide a method for forming the coating fi...

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Bibliographische Detailangaben
1. Verfasser:	KUDO SHIZUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a thermosetting powder coating material composition excellent in storage stability and solid-phase reaction resistance and further excellent in cutting workability and impact resistance of a coating film after coating and to provide a method for forming the coating film using the same composition. SOLUTION: This composition contains (a) 100 pts.wt. of an epoxy resin consisting essentially of a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin having 70-130 deg.C softening point and 500-3,000 g/equivalent epoxy equivalent, (b) an acid anhydride having >=2 acid anhydride groups bonded to an aromatic ring in one molecule in an amount so as to provide the number of mol of the acid anhydride groups of 0.3-2 times based on the number of mol of epoxy groups in 100 pts.wt. of the epoxy resin and (c) 30-150 pts.wt. of an inorganic filler having a particle shape of an amorphous powdery or a spherical or a needlelike form, 1-20 μm average particle diameter and 3-7 Mohs hardness.