BONDING DEVICE

PROBLEM TO BE SOLVED: To provide a bonding device, which can determine the position of a frame at high speed with high accuracy. SOLUTION: This device comprises a detection part 1, comprising a unidimensional line sensor 1a, a control part 2 having a drive circuit 2a for driving the unidirectional line sensor 1a and a light source part 3 for generating parallel light. Parallel light from the light source part 3 is emitted from the lower part of a frame. The parallel light is received by the unidirectional line sensor 1a. The level of the output signal from the unidirectional line sensor 1a is determined, and the position of the frame is detected. From the data of the detected position, the conveying amount of a frame conveying mechanism, which conveys frame to the specified bonding position, is controlled.