RESIST SOLUTION AND FORMATION OF PATTERN

PROBLEM TO BE SOLVED: To obtain a method for forming a pattern, which surely forms a pattern having a stencil shape by a simple method, without being effected due to exposure systems, a high-step substrate, or a resist solution, which is used for the method. SOLUTION: A first resist solution formed...

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Bibliographische Detailangaben
Hauptverfasser: ODAKA ISAMU, MEIKE KUNIHIKO, AKAGE YUICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a method for forming a pattern, which surely forms a pattern having a stencil shape by a simple method, without being effected due to exposure systems, a high-step substrate, or a resist solution, which is used for the method. SOLUTION: A first resist solution formed by a method, wherein a sensitizer within a resist solution is previously made to be decomposed with light irradiation, and the sensitiaer is turned into an indene ketene to put the indene ketene in a soluble state to alkali, is applied on a substrate 1 as a resist film 11, a second resist solution is applied on the film 11 as a resist film 12, ultraviolet rays are irradiated on the film 12 via a mask 3, and the films 11 and 12 are developed with an alkaline developing solution so as to form a pattern having a stencil shape 6.