WAFER CHUCK TABLE

WAFER CHUCK TABLE

PROBLEM TO BE SOLVED: To provide a wafer chuck table capable of reducing inertia while its strength is ensured. SOLUTION: Ribs 24 are radially formed on the back of a table body 12 formed in disk-like manner. Thus, the strength of the table body can be maintained even when the table body 12 itself i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IKEDA KAZUMI, FUSAYASU KAZUHISA
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wafer chuck table capable of reducing inertia while its strength is ensured. SOLUTION: Ribs 24 are radially formed on the back of a table body 12 formed in disk-like manner. Thus, the strength of the table body can be maintained even when the table body 12 itself is thinly formed. Further, the volume of the outer peripheral part of the table body 12 can thus be cut, and inertia can be reduced.