METHOD FOR SEALING OPTO-DEVICE BY HOLDING RESIN

PROBLEM TO BE SOLVED: To provide a method for sealing opto-device by molding resin by which the productivity and quality of an opto-device can be improved. SOLUTION: In a method for sealing opto-device by molding resin, a light emitting element section is preliminarily sealed with a resin compositio...

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Bibliographische Detailangaben
Hauptverfasser:	MORITA KATSUHISA, MATSUI FUMIO, OGIWARA KAZUE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for sealing opto-device by molding resin by which the productivity and quality of an opto-device can be improved. SOLUTION: In a method for sealing opto-device by molding resin, a light emitting element section is preliminarily sealed with a resin composition containing (A) vinyl ester, (B) one or more kinds of monomers selected from among a group composed of allyl ester monomer, acrylic acid ester monomer, and methacrylic acid ester monomer, (C) an N-nitrosophenyl hydroxyl amine salt, and (D) an organic peroxide. Then, after the resin composition is cured by heating and inserted into a prescribed mold, the empty space of the mold is filled up with the same resin composition and the composition is cured.