MANUFACTURE OF CENTER PAD SEMICONDUCTOR PACKAGE ELEMENT

PROBLEM TO BE SOLVED: To provide a manufacturing method for a center pad chip-size package element. SOLUTION: A step (Step 31) wherein a center pad semiconductor chip in which a plurality of bonding pads are formed in the center of an active face is attached to the rear surface of an elastic polymer and a tape wiring board which contains a plurality of beam leads is attached to the surface of the elastic polymer is contained. In addition, a step (Step 32) in which the beam leads are bonded to the bonding pads exposed via an opening in the elastic polymer is contained. In addition, a step in which the opening in the elastic polymer and the side face of the semiconductor chip are sealed with a liquid sealing resin having a prescribed viscosity is contained. In the sealing step, a primary sealing step (Step 34) in which a center sealing part is formed by feeding the sealing resin is contained, and a secondary sealing step (Step 35) in which a side-face sealed part is formed is contained. As a result, it is possible to prevent an unfilled defect in the sealing step, and the sealing time can be shortened by using the low-viscosity liquid sealing resin and/or by applying a vacuum.