PRINTED WIRING BOARD

PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To prevent an electric circuit failure such as a short circuit from occurring in electronic components or a circuit pattern on a board main body side by a method wherein the swarf of a copper foil layer or a solder plating layer is prevented from being left on the board main bo...

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Hauptverfasser: TAKIZAWA MASAHIKO, ISHIZAKI MASAKI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKIZAWA MASAHIKO
ISHIZAKI MASAKI
description PROBLEM TO BE SOLVED: To prevent an electric circuit failure such as a short circuit from occurring in electronic components or a circuit pattern on a board main body side by a method wherein the swarf of a copper foil layer or a solder plating layer is prevented from being left on the board main body. SOLUTION: A waste a solder plating layers 7 formed on both the front and rear of a board 5 are set wider in forming region on a waste board 2 side than on a board main body 1, and the exposed part of a solder plating layer where no resist film layer 8 is formed is formed on the solder plating layers provided in both the surfaces of the board 5. Furthermore, the exposed region K of the exposed part M of the solder plating layer formed on both sides of a board 5 is set wider in area on the waste board than on the board main body, a solder-filled 10 is provided to each of through-holes 9 that are each composed of a through-hole and a solder plating layer formed on its inner circumference, and a solder-fed part continuously connected to the solder-filled part 10 is formed on the exposed part of the solder plating layer.
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SOLUTION: A waste a solder plating layers 7 formed on both the front and rear of a board 5 are set wider in forming region on a waste board 2 side than on a board main body 1, and the exposed part of a solder plating layer where no resist film layer 8 is formed is formed on the solder plating layers provided in both the surfaces of the board 5. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED WIRING BOARD
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