PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To prevent an electric circuit failure such as a short circuit from occurring in electronic components or a circuit pattern on a board main body side by a method wherein the swarf of a copper foil layer or a solder plating layer is prevented from being left on the board main body. SOLUTION: A waste a solder plating layers 7 formed on both the front and rear of a board 5 are set wider in forming region on a waste board 2 side than on a board main body 1, and the exposed part of a solder plating layer where no resist film layer 8 is formed is formed on the solder plating layers provided in both the surfaces of the board 5. Furthermore, the exposed region K of the exposed part M of the solder plating layer formed on both sides of a board 5 is set wider in area on the waste board than on the board main body, a solder-filled 10 is provided to each of through-holes 9 that are each composed of a through-hole and a solder plating layer formed on its inner circumference, and a solder-fed part continuously connected to the solder-filled part 10 is formed on the exposed part of the solder plating layer.