SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which allows enhancement in performance and reliability, even if a semiconductor chip is electrically connected with a packaged body comprising a package substrate and the like using solder balls. SOLUTION: This semiconductor device has a semic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIMOTO RYOSUKE, TONO TOMOKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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